davinci: thermal: Build HAL

Change-Id: I066f6f1bbf45652bc62e76bfd489fc2b6694e421
This commit is contained in:
Arian 2020-04-15 14:49:17 +02:00
parent 9defaf4564
commit a18b9e2016
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@ -285,6 +285,14 @@ PRODUCT_COPY_FILES += \
frameworks/native/data/etc/android.hardware.telephony.cdma.xml:$(TARGET_COPY_OUT_VENDOR)/etc/permissions/android.hardware.telephony.cdma.xml \
frameworks/native/data/etc/android.software.sip.voip.xml:$(TARGET_COPY_OUT_VENDOR)/etc/permissions/android.software.sip.voip.xml
# Thermal
PRODUCT_PACKAGES += \
android.hardware.thermal@1.0-impl \
android.hardware.thermal@1.0-service
PRODUCT_PACKAGES += \
thermal.sm6150
# Touchscreen
PRODUCT_COPY_FILES += \
frameworks/native/data/etc/android.hardware.touchscreen.multitouch.jazzhand.xml:$(TARGET_COPY_OUT_VENDOR)/etc/permissions/android.hardware.touchscreen.multitouch.jazzhand.xml