lisa/android_device_xiaomi_sm8350-common
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sm8350-common: build android.hardware.thermal for qspmsvc

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This commit is contained in:
Cosmin Tanislav 2021-09-04 11:55:16 +03:00
parent 451a761bcd
commit 6b27fff825
1 changed files with 4 additions and 0 deletions
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4
common.mk
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@ -398,6 +398,10 @@ PRODUCT_PACKAGES += \
PRODUCT_PACKAGES += \ PRODUCT_PACKAGES += \
textclassifier.bundle1 textclassifier.bundle1
# Thermal
PRODUCT_PACKAGES += \
android.hardware.thermal@2.0
# Touchscreen # Touchscreen
PRODUCT_COPY_FILES += \ PRODUCT_COPY_FILES += \
frameworks/native/data/etc/android.hardware.touchscreen.multitouch.jazzhand.xml:$(TARGET_COPY_OUT_VENDOR)/etc/permissions/android.hardware.touchscreen.multitouch.jazzhand.xml frameworks/native/data/etc/android.hardware.touchscreen.multitouch.jazzhand.xml:$(TARGET_COPY_OUT_VENDOR)/etc/permissions/android.hardware.touchscreen.multitouch.jazzhand.xml