android_kernel_xiaomi_sm8350/drivers/net/bonding
Jay Vosburgh a816c7c712 bonding: Improve IGMP join processing
In active-backup mode, the current bonding code duplicates IGMP
traffic to all slaves, so that switches are up to date in case of a
failover from an active to a backup interface.  If bonding then fails
back to the original active interface, it is likely that the "active
slave" switch's IGMP forwarding for the port will be out of date until
some event occurs to refresh the switch (e.g., a membership query).

	This patch alters the behavior of bonding to no longer flood
IGMP to all ports, and to issue IGMP JOINs to the newly active port at
the time of a failover.  This insures that switches are kept up to date
for all cases.

	"GOELLESCH Niels" <niels.goellesch@eurocontrol.int> originally
reported this problem, and included a patch.  His original patch was
modified by Jay Vosburgh to additionally remove the existing IGMP flood
behavior, use RCU, streamline code paths, fix trailing white space, and
adjust for style.

Signed-off-by: Jay Vosburgh <fubar@us.ibm.com>
Signed-off-by: Jeff Garzik <jeff@garzik.org>
2007-03-06 06:08:11 -05:00
..
bond_3ad.c [PATCH] bonding: Don't mangle LACPDUs 2006-09-25 20:08:09 -04:00
bond_3ad.h [PATCH] bonding: support carrier state for master 2006-03-29 17:34:02 -05:00
bond_alb.c [BONDING]: Replace kmalloc() + memset() pairs with the appropriate kzalloc() calls 2007-02-08 12:38:59 -08:00
bond_alb.h
bond_main.c bonding: Improve IGMP join processing 2007-03-06 06:08:11 -05:00
bond_sysfs.c [PATCH] remove many unneeded #includes of sched.h 2007-02-14 08:09:54 -08:00
bonding.h bonding: update version 2007-02-05 16:58:47 -05:00
Makefile