lisa/android_kernel_xiaomi_sm8350
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android_kernel_xiaomi_sm8350/drivers/net/bonding
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John W. Linville df49898a47 [PATCH] bonding: cleanup comment for mode 1 IGMP xmit hack 
Expand comment explaining MAC address selection for replicated IGMP
frames transmitted in bonding mode 1 (active-backup).  Also, a small
whitespace cleanup.

Signed-off-by: John W. Linville <linville@tuxdriver.com>
Signed-off-by: Jeff Garzik <jgarzik@pobox.com>
2005-10-18 22:27:13 -04:00
..
bond_3ad.c [NET]: Kill skb->real_dev 2005-08-29 15:32:25 -07:00
bond_3ad.h [NET]: Kill skb->real_dev 2005-08-29 15:32:25 -07:00
bond_alb.c [NET]: Kill skb->real_dev 2005-08-29 15:32:25 -07:00
bond_alb.h Linux-2.6.12-rc2 2005-04-16 15:20:36 -07:00
bond_main.c [PATCH] bonding: cleanup comment for mode 1 IGMP xmit hack 2005-10-18 22:27:13 -04:00
bonding.h [PATCH] fix bonding crash, remove old ABI support 2005-10-03 22:15:00 -04:00
Makefile Linux-2.6.12-rc2 2005-04-16 15:20:36 -07:00