Jay Vosburgh e4b91c4846 bonding: fix device name allocation error ... The code to select names for the bonding interfaces was, for the non-sysfs creation case, always using a hard-coded set of bond0, bond1, etc, up to max_bonds. This caused conflicts for the second or subsequent loads of the module. Changed the code to obtain device names from dev_alloc_name(). Signed-off-by: Jay Vosburgh <fubar@us.ibm.com> Signed-off-by: Jeff Garzik <jeff@garzik.org>		2007-02-05 16:58:47 -05:00
..
bond_3ad.c	[PATCH] bonding: Don't mangle LACPDUs	2006-09-25 20:08:09 -04:00
bond_3ad.h	[PATCH] bonding: support carrier state for master	2006-03-29 17:34:02 -05:00
bond_alb.c	[PATCH] bonding: fix deadlock on high loads in bond_alb_monitor()	2006-10-05 07:01:25 -04:00
bond_alb.h
bond_main.c	bonding: fix device name allocation error	2007-02-05 16:58:47 -05:00
bond_sysfs.c	[PATCH] bonding: Validate probe replies in ARP monitor	2006-09-25 20:08:09 -04:00
bonding.h	bonding.h: "extern inline" -> "static inline"	2007-02-05 16:58:47 -05:00
Makefile